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Glass transition temp.

2.4.25

DSC

℃

180

TMA

℃

184

DMA

℃

210

CTE,Z-axis

2.4.24

α1，TMA

ppm/℃

33

α2，TMA

ppm/℃

194

50~260℃，TMA

%

1.8

Decomposition Temp.

2.4.24.6

TGA

℃

385

T288

2.4.24.1

TMA,unclad

min

>60

Thermal stress

2.4.13.1

Copper clad

sec

>120

unclad

sec

>180

Water absorption

2.6.2.1

E-1/105+D-24/23

%

0.1

Peel Strength/18μm

2.4.8

as received

lb/in

6.5

after thermal stress

lb/in

6.5

Permittivity(RC50%)

2.5.5.9

C-24/23/50,1G

/

4.2

Loss tagent(RC50%)

2.5.5.9

C-24/23/50,1G

/

0.010

Volume resistivity

2.5.17.1

C-96/35/90

MΩ·cm

4.70*10¹⁰

Surface resistivity

2.5.17.1

C-96/35/90

MΩ

3.54*10⁸

Arc Resistance

2.5.1

D48/50+D0.5/23

sec

130

Dielectric Breakdown

2.5.6

D48/50+D0.5/23

kV

60

Flexural strength

Warp

2.4.4

as received

MPa

550

Fill

2.4.4

as received

MPa

450

Flame resistance

UL-94

A&E-24/125

/

V0

CTI

C-96/20/65

IEC-60112

Rating

PLC3